SMDLTLFP250T4

SMDLTLFP250T4

Kaihanga

Chip Quik, Inc.

Kāwai Hua

solder

Whakaahuatanga

SOLDER PASTE LOW TEMP T4 250G

RFQ Īmēra: [email protected] or Uiui ipurangi

Whakatakotoranga

  • raupapa
    -
  • mōkihi
    Jar
  • mana wahanga
    Active
  • momo
    Solder Paste
  • titonga
    Bi57.6Sn42Ag0.4 (57.6/42/0.4)
  • diameter
    -
  • ira whakarewa
    281°F (138°C)
  • momo rerenga
    No-Clean
  • ine waea
    -
  • tukanga
    Lead Free
  • puka
    Jar, 8.8 oz (250g)
  • ora papa
    6 Months
  • ka timata te oranga o te papa
    Date of Manufacture
  • te pāmahana rokiroki / whakamatao
    37°F ~ 46°F (3°C ~ 8°C)

SMDLTLFP250T4 Tonoa he Korero

Kei roto i nga taonga 1416
Te nui:
Utu Waeine (Utu Tohutoro):
83.95000
Utu whainga:
Tapeke:83.95000

Pepa Raraunga

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